Xinxiang Filter

Industry Pain Points

Semiconductor manufacturing imposes extremely strict cleanliness requirements. As process nodes shrink to 7 nm, 5 nm and even 3 nm, the sensitivity of wafer fabrication to airborne particles, airborne molecular contaminants (AMC), metal ions and trace impurities in ultra-pure water (UPW) rises exponentially.

A single particle as small as 0.1 μm attached to a photomask may render hundreds of chips on an entire wafer defective. Metal ion contamination at the ppb level in photoresist alters the photosensitive properties of photoresist and causes line width shift. Ions such as boron and sodium at ppt levels in ultra-pure water are doped into oxide films during gate oxide formation, shifting threshold voltage and directly triggering electrical failure of chips.

In addition, acid gases (HF, HCl, H₂SO₄), alkaline gases (NH₃), condensable organics (siloxanes, phthalates) and dopant gases (boron, phosphorus, etc.) present in fab cleanroom air will form haze residues or chemical stains on wafer surfaces, severely lowering product yield.

Solutions & Applications

1. Cleanroom Environment ControlWe supply a full lineup of cleanroom filters including pre-filters, medium-efficiency filters, sub-high-efficiency filters and ultra-high-efficiency filters to precisely maintain air cleanliness from ISO Class 3 to ISO Class 6 for wafer fabrication, packaging & test workshops and lithography zones.

2. Process Equipment Supporting FiltrationOn-board HEPA/ULPA filter units are matched for lithography machines, etchers, PVD/CVD equipment and wet cleaning tools to shield core process chambers from particle contamination.

3. High-Purity Chemical & UPW PurificationPTFE pleated filter cartridges, high-purity PP filter cartridges and ultrafiltration membranes are adopted for terminal fine filtration of photoresist, developer, etchant, CMP slurry and ultra-pure water, restricting metal ion leaching to below ppb levels.

4. AMC (Airborne Molecular Contaminants) ControlTailored chemical filtration solutions are developed to meet stringent AMC standards for advanced nodes, efficiently removing acid gases, alkaline gases and condensable organics from process air.

Typical Application Scenarios

• 12-inch / 8-inch wafer fab cleanrooms (lithography, etching and thin-film areas)

• Lens purge microenvironments for lithography tools

• CMP (Chemical Mechanical Planarization) slurry filtration systems

• Chemical circulation pipelines of wet etching equipment

• Terminal polishing loops of UPW (Ultra-Pure Water) systems

• Gas purification modules for FOUP (Front Opening Unified Pod)