Semiconductor & PV Process Filters

F8-F9 Grade Medium Efficiency Air Filters

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F8-F9 grade medium efficiency filters deliver clean cooling air or purge gas to process chambers in direct contact with wafers or solar cells, effectively preventing particulate contaminants generated by moving parts inside equipment from polluting production processes. In accordance with EN 779 / ISO 16890 standards, their filtration efficiency for particles ≥0.4 μm reaches ≥75% for F8 and ≥85% for F9 respectively.

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Description:

F8-F9 grade medium efficiency filters supply clean cooling air or purge gas to process chambers that come into direct contact with wafers or solar cells, effectively preventing particulate contamination generated by moving internal equipment components from interfering with manufacturing processes. In accordance with EN 779 / ISO 16890 standards, their filtration efficiency for particles ≥0.4 μm reaches ≥75% (F8) and ≥85% (F9) respectively.

Core Technical Advantages:

Compact and modular design: Optimized for limited internal equipment space, typically only 25–50 mm thick, compatible with standard slot mounting for FFUs or equipment air inlets.

Low pressure drop and high dust holding capacity: Compared with standard HVAC filters of the same size, optimized filter media pleat height and spacing reduce fan power consumption while maintaining F9 efficiency.

Chemical corrosion resistance and low outgassing: Filter media and sealants adopt low-VOC materials, resisting trace acid and alkaline gases in process environments to eliminate secondary contamination risks.

Optional all-metal high-temperature resistant structure: For high-temperature equipment such as PECVD, all-stainless steel frames with metal corrugated or aluminum foil separators are available for continuous operation at 120–150°C.

Working Condition Matching Table

Equipment TypeEquipment FunctionRecommended GradeKey Requirements
Lithography machine projection objective lensConstant temperature & humidity gas purge inside lensF9Ultra-low pressure drop, uniform face velocity
Coater & Developer Track EquipmentSMIF Pod purge for wafer cassettesF8Low metal ion leaching
Plasma EtcherAir intake for reaction chamber cooling ductF8Plasma gas corrosion resistance
PECVDChamber purge for preheating moduleF9All stainless steel, temperature resistance ≥120°C
Diffusion / Oxidation FurnaceClean air curtain at furnace mouthF8Compact slot-mounted design


Application Fields:

Semiconductor front-end process equipment

Semiconductor lithography equipment

Semiconductor vacuum pump and exhaust gas treatment systems

PV cell manufacturing equipment

PECVD equipment

PV cell sintering furnaces

Case & Data Verification

Custom compact F9 filters with optimized pleat patterns were supplied for the lens purge system of a lithography equipment manufacturer, boosting dust holding capacity by 40%. The replacement cycle was extended from 3–4 months to 10 months, reducing equipment downtime frequency.

FAQ:

Q: Can equipment-grade F9 filters replace H13 HEPA filters?

A: No. Equipment F9 filters are mainly used for scenarios requiring ISO Class 7–8 cleanliness such as cooling and purging. H13 HEPA filters are adopted for wafer transport or chemical filtration with strict particle control standards. Selection shall comply with the equipment’s particle control specifications.

Q: How to verify the performance of equipment filters?

A: On-site scanning leak testing can be conducted to check sealing performance after installation. Inline particle counters can also be fitted to monitor downstream gas cleanliness in real time.


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