Xinxiang Filter

Description:
H13/H14 grade HEPA air filters provide local ultra-clean environments of ISO Class 3–5 (Class 1–100) for key modules of lithography machines, electron beam inspection equipment, Front Opening Unified Pods (FOUP) and other devices, preventing wafers being transported or processed from atmospheric particulate contamination. In accordance with EN 1822 standard, they achieve filtration efficiency of ≥99.95% (H13) or ≥99.995% (H14) for MPPS (Most Penetrating Particle Size).

Core Technical Advantages:

Ultra-high efficiency and ultra-low resistance: Made of PTFE filter media, they deliver over 30% lower initial pressure drop compared with traditional glass fiber media at H14 efficiency, directly extending the service life of equipment fans and cutting energy consumption.

Ultra-clean manufacturing with extremely low metal ion leaching: All components are assembled in Class 100 cleanrooms and treated with DI water rinsing process. The leaching volume of key metal ions such as Na, K and Fe is ≤0.1 ppb, meeting stringent requirements of 12-inch wafer fabs.

Optional integrated gel-seal frame: Matching precision-machined aluminum alloy sealing frames are available for direct integration into equipment design to ensure zero-leakage installation.

Working Condition Matching Table

Application Fields:

Lithography process of semiconductor equipment

Electron beam inspection for semiconductor equipment

PECVD for photovoltaic cell equipment (HJT/TOPCon)

Case & Data Verification

Custom fan filter units equipped with H14 PTFE filter media and precision-machined gel-seal frames were provided for a coater & developer equipment manufacturer. Actual test results show the count of particles ≥0.1μm in equipment environment is less than 10 per cubic meter, far exceeding design indicators. The products significantly reduce equipment debugging and on-site customer maintenance costs caused by contamination.

FAQ:

Q: When is gel sealing required?

A: Gel sealing can deliver reliable zero-leakage performance when equipment environments require extremely strict control of particles ≥0.1μm (such as lithography and inspection), or the installation space is narrow with insufficient reliability of mechanical compression.